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HOME >> NEWS >> DISCO Corporation Precision wafer processing equipment

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DISCO Corporation Precision wafer processing equipment

From:DISCO Corporation | author:kongjiang | Release :2026-05-18 | 4 view: | 🔊 Click to read aloud ❚❚ ▶ | Share:
Disco grinding, polishing and dicing machines are high-precision wafer processing equipment manufactured by DISCO Corporation. They integrate three core processes: wafer dicing, backside grinding and surface polishing, mainly used for thinning wafers and cutting them into individual chips in semiconductor packaging processes.

Core Functions

  1. Wafer DicingModel series: DFD seriesFunction: Divide complete wafers into independent diesHigh micron-level precision, effectively reduce chipping and crackingApplicable materials: silicon wafer, silicon carbide, gallium arsenide, sapphire, etc.
  2. Wafer Backside GrindingModel series: DFG seriesFunction: Thin the backside of semiconductor wafersSupport ultra-thin grinding, minimum grinding thickness up to 5μmAdopt Taiko ring support technology to prevent wafer warpage and deformation
  3. Surface PolishingModel series: DGP integrated grinding & polishing machineFunction: Remove process damage layer, release internal stress and achieve mirror surface finishSupport dry polishing and CMP polishing methods, greatly improve chip bending strength

Main Popular Models

  • Dicing Machine: DFD6342 full-automatic dual-spindle dicing saw

  • Grinding & Polishing All-in-One Machine: DGP8761 (for 300mm wafer)

Application Fields

Semiconductor post-packaging process, power devices, MEMS chips, compound semiconductors, 3D chip stacking and TSV production.

Product Advantages

  • High machining accuracy, wafer thickness uniformity ≤1.5μm

  • Low processing damage, stable operation performance

  • Full automatic feeding, blade replacement and inspection

  • Support DBG advanced process to improve production yield and efficiency

Industry Status

DISCO occupies over 70% of the global market share of wafer processing equipment, which is standard equipment widely adopted by mainstream packaging and testing factories worldwide.
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